PPE Black ESD JEDEC Matrix Trays For Electronic Components
ESD JEDEC Matrix Tray is the packaging tray used by the enterprise for Electronic components packaging test.
The materials required for the tray are conductive, anti-static, high temperature resistance, high strength and other characteristics. Electronic components have high material requirements,so PPE plus carbon fiber reinforcement materials are generally selected. This can well meet the material performance requirements of IC antistatic tray.
Details about The HN21089 PPE Black ESD JEDEC Matrix Trays For Electronic Components
The HN21089 is made of PPE and mixed materials, which ensures that the JEDEC standard tray is very strong with minimal warping control. The 3 x 5 matrix design allows automatic equipment to pick up loaded products. When designing a tray for a rectangular package,the longest dimension of the package is oriented parallel to the longest length of the tray to maximize tray pocket density The 45-degree chamfer is also easier for equipment to identify and locate, reducing labor costs.
| Outline Line Size |
322.6*135.9*10.5mm |
Brand |
Hiner-pack |
| Model |
HN21089 |
Package Type |
N/A |
| Cavity Size |
5.35*4.55*1.28mm |
Matrix QTY |
3*5=15PCS |
| Material |
PPE |
Flatness |
MAX 0.76mm |
| Color |
Black |
Service |
Accept OEM,ODM |
| Resistance |
1.0x10e4-1.0x10e11Ω |
Certificate |
ROHS SGS |
2.Application of The HN21085 JEDEC Matrix Tray
IC Component Electronic Component
Semiconductor Micro and Nano systems and Sensor IC etc
3.Reference to temperature resistance of different materials
| Material |
Bake Temperature |
Surface Resistance |
| PPE |
Bake 125°C~Max 150°C |
1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber |
Bake 125°C~Max 150°C |
1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder |
Bake 125°C~Max 150°C |
1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber |
Bake 125°C~Max 150°C |
1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber |
Max 180°C |
1.0*10E4Ω~1.0*10E11Ω |
| IDP Color |
85°C |
1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized |
4.Advantages of Jedec tray
1.Suitable for components or devices daily turnover or long-distance freight.
2.Can be stacked more layers;
3.Can be washed at high temperature;
4.Plastic waterproof, moisture-proof, improve the storage time of components;
5.No extrusion and breakage, Better protection components；
6.Reusable, quality assurance.
5.FAQ
Q1: Are You Manufacturer or Trade Company?
We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.
Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.
Q7: When can we get the samples?
We can send you them right now if you are interested in something we have stock, and customize
the project depending on the specific time.
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