Hiner-pack has leading mould processing and injection molding equipment,high level dustless cleaning devices and a variety of testing equipment.Meanwhile,Hiner-pack has established a depth of cooperation with well-known enterprises and built a polymer material R&D base with domestic well-known universities as well as researching institutions.Hiner-pack has mastered special process technique and manufacturing in semiconductor packaging raw material field.Owned a lot of inventions and practical new patents.Through years of unremitting efforts,Hiner-pack has a professional R&D team to improve semiconductor packaging products,constantly launch new products,and solve the customers’ demand for high quality products.
Product Advantage
1. Have exported for more than 10 years
2. Have professional engineer and efficient management
3. Delivery time is short, normally in stock
4. Small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to USA, Germany, UK, Europe, Korea, Japen...etc, Win many big famous customer reputation.
7. Factory have ISO certificate, Product comply to Rohs standard.
Product Application
Electronic component Semiconductor Embedded System Display technology
Micro and Nano systems Sensor Test and Measurement Techology
Electromechanical equipment and systems Power supply
Reference to temperature resistance of different materials
| Material |
Bake Temperature |
Surface Resistance |
| PPE |
Bake 125°C~Max 150°C |
1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber |
Bake 125°C~Max 150°C |
1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder |
Bake 125°C~Max 150°C |
1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber |
Bake 125°C~Max 150°C |
1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber |
Max 180°C |
1.0*10E4Ω~1.0*10E11Ω |
| IDP Color |
85°C |
1.0*10E6Ω~1.0*10E10Ω |
|
Color, temperature and other special requirements can be customized
|
| Outline Line Size |
135.9*322.6*30.4mm |
Brand |
Hiner-pack |
| Model |
HN 2026 |
Package Type |
Connector |
| Cavity Size |
141.46*6.7*22.35mm |
Matrix QTY |
12*2=24PCS |
| Material |
HIPS |
Flatness |
MAX 0.76mm |
| Color |
Black |
Temperature |
150°C |
| Resistance |
1.0x10e4-1.0x10e11Ω |
Service |
Accept OEM,ODM |
FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.
